MEMS and NEMS

  • RF Devices

    Micro and Nano-scaled RF-circuit components can be fabricated using traditional CMOS and Thin-film techniques.

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  • Lift-Off

    Lift-off deposition requires thin, highly-uniform, high-quality layers deposited on pre-patterned substrates.

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  • Glancing Angle Deposition

    An emerging technique that leverages the high-angle of incidence and ballistic shadowing effects of inbound evaporant species to create self-assembled micro and nanostructures.

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  • Controlled Temp Growth

    Precision control of substrate temperature allows for creation of specific grain sizes, crystal structures/orientations, or stochiometric states of co-deposited materials.

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