Uniform Deposition

The Nanochrome Indium Deposition System is designed to thermally evaporate high volumes of solder contact metal materials such as indium. Our geometry ensures a very flat and uniform deposition front for superior "lift-off" capability. Whiskers and splatters are no longer a problem resulting in increased device yields and the ability to make smaller contacts on your wafers.

Designed for "Lift-Off"

The Indium Deposition System is designed for "lift-off" processes providing a high level of automatically or manually controlled deposition of materials. Additional features include:

• specialized thermal evaporation technology
• in-situ plasma cleaning
• low temperature substrate stage
• high vacuum environment to achieve high quality film growth by using all dry pumping technology

Key Benefits

• “Lift-off” geometry  
• Uniform coating
• Extremely small feature sizes possible
• In-situ plasma cleaning
• High quality film growth

Configurations Designed For:

• Single wafer batch up to 200mm
• Single wafer robotic load and unload
• Bulkhead and Ballroom design to minimize clean room footprint

The Nanochrome Family of Systems are used to make:

• Indium Bump bonding for fabrication of focal plane arrays
• Ohmic contacts for III-V and II-VI materials with diffusion barriers
• Precision optical coatings by Ion Beam and Magnetron Sputtering
• Optical filters, Gratings
• Anti-reflective and Anti-scratch Coatings for IR optics
• Semiconductors & Dielectric Materials
• Superconductors