Designed for clean room operation, the Nanoquest II keeps the etch module in the service area of the clean room. A double door etch module allows servicing from either side of the chamber. UHV design rules ensure that the etch module and load-lock chamber achieve very low base pressures. Nanoquest II Ion Beam Etching System combines a water-cooled, rotating stage, a 22cm RF ion source, an easily accessible stainless steel vacuum chamber, cryogenic high vacuum pumping system, automatic pump down and venting, atmosphere to high vacuum gauging, mass flow controllers, chamber cabinet, and electronic control console.
The Nanoquest comes supplied with 150mm and 100mm wafer platens for load locked configuration with carbon masks for smaller sized wafers. With uniformity of ± 3% over a 100mm diameter, and a repeatability of ± 2% wafer to wafer, the Nanoquest is the ideal platform for your process.
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