Nanoquest I Ion Beam Etching & Deposition System

The Nanoquest I by Intlvac Thin Film is the most versatile ion beam development platform available for research and development. Designed for both etching and thin film deposition, this system offers unmatched control and flexibility. Ion beam technology enables precise, repeatable processes through independent control of ion energy, ion current density, and beam incidence angle—making it ideal for everything from simple inert etching to complex multi-layer thin film structures.

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Engineered for Precision

The Nanoquest I system is built for high-performance operation in demanding research environments:

  • Ion Beam  Control :  Fine-tuned adjustment of ion parameters ensures maximum process flexibility 
  •         and repeatability.
  • Dual Functionality:  Supports both ion beam etching and deposition in a single platform.
  • R&D Focused: Tailored for experimental workflows, custom configurations, and material innovation.

Robust System Design

The Nanoquest I’s ultra-high vacuum (UHV) chamber is constructed from stainless steel using UHV-compatible techniques. An electro-polished exterior offers a clean, professional appearance for integration into cleanroom environments.

  • Efficient Thermal Management: Stainless steel cooling channels are welded in a web pattern to serve as an effective heat sink.
  • Optimized Access: The hinged, differentially pumped front door provides easy chamber access.
  • Process Visibility: Multiple viewports, including one for the optional load lock, enable complete observation of internal processes.

Nanoquest I-LL: Load Lock System

For enhanced throughput and contamination control, the Nanoquest I-LL configuration includes an advanced load lock chamber.

  • Magnetically Coupled Drive: Safely transports wafers mounted to a carrier platen into the main chamber.
  • Faster Cycle Times: Rapid sample exchange without breaking vacuum.
  • Cleaner Processing: Significantly reduces water vapor and particulates, minimizing process drift.
  • Vacuum Performance: Achieves 1×10⁻⁶ Torr in under 30 minutes and reaches 5×10⁻⁸ Torr in 24 hours using dry pumps and either a Cryopump or Maglev Turbo Pump.

Advanced System Control

Automation is handled via a LabVIEW-based interface, offering complete system management within an intuitive Windows environment.

  • Auto Sequencing: Fully automated control of pneumatic actuators for chamber pump-down and venting.
  • Process Reliability: Precise control ensures repeatability across sessions.
  • AutoVac Integration: Seamless system venting with Intlvac’s AutoVac Controller.

Precision Substrate Handling

The Nanoquest I’s substrate stage is engineered for superior etching and deposition uniformity, accommodating wafers up to 6 inches in diameter.

  • Rotation: 0–45 RPM with offset control for uniform results.
  • Incident Angle Control: Stepper motor driven with computer control, adjustable from 0° to 270° under vacuum with better than ±0.1° precision.
  • Water-Cooled Stage: Direct cooling ensures thermal stability throughout processing.
  • Accessibility: Stage is door-mounted and swings out for full chamber access.
  • Integrated Shutter: Pneumatically operated with optional beam current probe.

Process Methods

  • Ion Beam Etching
  • Ion Beam Sputter Deposition
  • Ion Beam Assisted Deposition (IBAD)
  • Reactive Ion Beam Deposition (RIBE)
  • Chemically Assisted Ion Beam Etching (CAIBE)

Why Choose Nanoquest I

  • Unmatched control over thin film etching and deposition
  • Compact and cleanroom-ready stainless steel design
  • Optional load lock for higher throughput and cleanliness
  • Advanced computer control for automated process management
  • Full visibility with multiple integrated viewports
  • Configurable for ion beam sputtering, e-beam deposition, and GLAD

Ion Beam and Plasma Processing Technologies


Intlvac delivers advanced ion beam and plasma processing solutions for precision etching, thin film deposition, surface modification, and substrate cleaning. Each technology offers distinct performance advantages , from highly controlled, directional ion beam treatments to uniform plasma-based processing ,  enabling optimized results across a wide range of materials. Built on decades of vacuum engineering expertise, our systems are designed to meet the demanding requirements of aerospace, optics, semiconductor, and research applications. We work closely with customers to configure reliable, application-specific solutions for both R&D and production environments.

Our core process technologies include:
  • Ion Beam Etching (IBE) / Ion Beam Milling (IBM)
  • Chemically Assisted Ion Beam Etching (CAIBE)
  • Reactive Ion Beam Etching (RIBE) 
  • Ion Beam Trimming (IBT)
  • Ion Beam Sputtering  (IBS)



Ion Beam Etching (IBE) / Ion Beam Milling (IBM)

Ion Beam Etching is a highly controlled physical sputtering process in which energetic ions are directed toward a substrate to achieve precise, anisotropic material removal. The broad, collimated ion beam ensures excellent uniformity across the substrate surface, while programmable substrate motion further enhances process consistency. The result is repeatable, chemistry-independent etching suitable for advanced thin film patterning and precision component fabrication.

Other Systems

  • Nanoquest ii
  • Nanoquest iii
  • Nanoquest Pico

Chemically Assisted Ion Beam Etching (CAIBE)

Chemically Assisted Ion Beam Etching introduces reactive gases directly at the substrate surface during ion bombardment. The localized chemical interaction increases material removal rates and enhances selectivity while maintaining directional control. CAIBE is particularly effective for compound materials and applications demanding tailored etch behavior.

Other Systems

  • Nanoquest ii
  • Nanoquest iii
  • Nanoquest Pico

Reactive Ion Beam Etching (RIBE) 

Reactive Ion Beam Etching combines physical ion bombardment with reactive species generated within the ion source. The simultaneous chemical and physical interaction enhances etch efficiency, improves selectivity, and enables refined feature definition. This approach is well suited for structured surfaces requiring controlled profiles and optimized throughput.

Other Systems

  • Nanoquest ii
  • Nanoquest iii
  • Nanoquest Pico

Ion Beam Trimming (IBT)

Ion Beam Trimming utilizes a finely defined ion beam to selectively remove material with nanometer-scale precision. Through controlled beam scanning and dwell time adjustment, material thickness can be tuned locally to achieve targeted device or performance characteristics. The process enables deterministic, high-accuracy corrections in advanced functional components.

Other Systems
  • Nanoquest ii
  • Nanoquest iii
  • Nanoquest Pico
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