Electra-UHV Sputtering Deposition System

The Electra UHV Sputtering System by Intlvac is a compact, purpose-built platform engineered for advanced thin film deposition in ultra-high vacuum (UHV) environments, achieving base pressures in the 10⁻¹⁰ Torr range. Designed for precision and flexibility, the Electra is ideal for prototyping and research & development of cutting-edge materials.

Equipped with Intlvac’s proprietary LabVIEW-based controller, the Electra enables automated sputtering of magnetic metals and insulating materials. The system is fully customizable to meet a wide range of material and process requirements.

The Electra-M variant includes a load-lock system for pre-loading and degassing single or multiple substrates, supporting high-throughput workflows and reducing contamination risks.

Electra-UHV Sputtering Deposition System

The Electra UHV Sputtering System by Intlvac is a compact, purpose-built platform engineered for advanced thin film deposition in ultra-high vacuum (UHV) environments, achieving base pressures in the 10⁻¹⁰ Torr range. Designed for precision and flexibility, the Electra is ideal for prototyping and research & development of cutting-edge materials.

Equipped with Intlvac’s proprietary LabVIEW-based controller, the Electra enables automated sputtering of magnetic metals and insulating materials. The system is fully customizable to meet a wide range of material and process requirements.

The Electra-M variant includes a load-lock system for pre-loading and degassing single or multiple substrates, supporting high-throughput workflows and reducing contamination risks.

Key Applications

MRAM development
Metallization processes
Crystal growth research
Oxide and nitride film deposition
Magnetic material prototyping

System Specifications

Compact ‘D’-shaped clamshell chamber
Up to 6 × 2” magnetron sputter sources
Base pressure < 5 × 10⁻⁹ Torr
Accommodates substrates up to 100 mm wafers
Substrate temperature up to 800°C

System Features

UHV base pressures with rapid pump-down via load-lock
Growth of amorphous or crystalline films
Substrate rotation, heating (800°C), or cooling with optional bias
Rotating substrate holder for high-temperature stability
Configurable with ion assist sources
Supports sequential or co-deposition
Compatible with 100 mm wafers and smaller carriers
Available in sputtering and evaporation configurations

Physical Vapor Deposition Options

Magnetron Sputtering: RF, DC, or Pulsed DC
Ion Source: For substrate cleaning or assist during film growth
Load-lock chamber with magnetic manipulator for 100 mm wafer transfers
Customizable substrate fixtures: single, multiple, planetary, or specialized designs

Precision Coating, Proven Performance

With decades of expertise in thin film technology, Intlvac’s Electra UHV platform offers the purity, control, and reliability demanded by today’s most advanced research and fabrication facilities.

thinfilm@intlvac.com | 1.800.959.5517